Behavioral & Test Circuits
Input reflected ripple
measurement point
F1
1.5 A
Fuse
+In
+Out
+
Notes:
Enable/Disable Switch
Source inductance should be no more than 200 nH. If source inductance is
K
C1
2 μF
electrolytic
SW1
D1
R2
2 k Ω
TM
R SV
PC
-In
-Out
BCM
+Out
Ro -Out
R3
5 m Ω
C3
10 μF
Load
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
Figure 18 — BCM test circuit
V?I Chip Bus Converter Level 1 DC Behavioral Model for 352 V to 11 V, 300 W
I OUT
R OUT
+
9.8 m
+
1/32 ? Iout
V ? I
1/32 ? Vin
V IN
I Q
18 mA
+
+
V OUT
K
?
Figure 19 — This model characterizes the DC operation of the V?I Chip bus converter, including the converter transfer function and its losses. The model enables
estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V?I Chip Bus Converter Level 2 Transient Behavioral Model for 352 V to 11 V, 300 W
0.22 nH
L IN = 5 nH
I OUT
R OUT
Lout = 1.1 nH
+
V IN
C IN
R C IN
32 m Ω
0.3μF
I Q
18 mA
1/32 ? Iout
+
V ? I
K
+
1.1 m Ω
1/32 ? Vin
9.8 m Ω
C OUT
R C OUT
0.2 m Ω
37 μF
+
V OUT
?
Figure 20 — This model characterizes the AC operation of the V?I Chip bus converter including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or
without external filtering elements.
vicorpower.com
800-735-6200
V?I Chip Bus Converter
BCM352F110T300A00 & BCM352T110T300A00
Rev. 1.6
Page 9 of 11
相关PDF资料
EBM08DTAH-S189 CONN EDGECARD 16POS R/A .156 SLD
R1S-2405-R CONV DC/DC 1W 24VIN 05VOUT
B384F120T30-EB HV BCM BUS CONVERTER EVAL BOARD
EBM08DTAD-S189 CONN EDGECARD 16POS R/A .156 SLD
A9CAG-1205F FLEX CABLE - AFG12G/AF12/AFE12T
RO-053.3S/P CONV DC/DC 1W 05VIN 3.3VOUT
B048F480T30-EB EVAL BOARD 48V OUT 300W SMD
GBM10DRYN-S13 CONN EDGECARD 20POS .156 EXTEND
相关代理商/技术参数
BCD352F125T300A00 功能描述:HV BCM BUS CONVERTER EVAL BOARD RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:V-I Chip™, BCM™ 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC,步升 输出及类型:1,非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969
BCD352F440T330A00 功能描述:HV BCM BUS CONVERTER EVAL BOARD RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:V-I Chip™, BCM™ 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC,步升 输出及类型:1,非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969
BCD380P475C1K2A30 制造商:Vicor Corporation 功能描述:BCD380P475C1KA30 Eval Board
BCD380P475C1KA30 制造商:Vicor Corporation 功能描述:BCD380P475C1KA30 Eval Board
BCD380P475T1K2A30 功能描述:BCM380y475x1K2A30 VI Chip? BCM? DC/DC, Step Down 1, Isolated Outputs Evaluation Board 制造商:vicor corporation 系列:VI Chip? BCM? 零件状态:有效 主要用途:DC/DC,步降 输出和类型:1,隔离 功率 - 输出:1200W 电压 - 输出:47.5V 电流 - 输出:25.7A 电压 - 输入:260 V ~ 410 V 稳压器拓扑:降压 频率 - 开关:1.18MHz 板类型:完全填充 所含物品:板 使用的 IC/零件:BCM380y475x1K2A30 标准包装:1
BCD384F120T300A00 功能描述:BCM384x120y300A00 VI Chip? BCM? DC/DC, Step Down 1, Isolated Outputs Evaluation Board 制造商:vicor corporation 系列:VI Chip? BCM? 零件状态:有效 主要用途:DC/DC,步降 输出和类型:1,隔离 功率 - 输出:300W 电压 - 输出:12V 电流 - 输出:27.7A 电压 - 输入:360 V ~ 400 V 稳压器拓扑:降压 频率 - 开关:1.95MHz 板类型:完全填充 所含物品:板 使用的 IC/零件:BCM384x120y300A00 标准包装:1
BCD384F480T325A00 功能描述:EVALUATION BOARD BCM BUS CONVERT RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:V-I Chip™, BCM™ 标准包装:1 系列:- 主要目的:DC/DC,步降 输出及类型:1,非隔离 功率 - 输出:- 输出电压:3.3V 电流 - 输出:3A 输入电压:4.5 V ~ 28 V 稳压器拓扑结构:降压 频率 - 开关:250kHz 板类型:完全填充 已供物品:板 已用 IC / 零件:L7981 其它名称:497-12113STEVAL-ISA094V1-ND
BCD40 制造商:EDI 制造商全称:Electronic devices inc. 功能描述:100mA SILICON CARTRIDGE RECTIFIERS